IEC 60191-6-21:2010 EN-FR 10976b2e
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
现行
发布日期 :
2010-08-30
实施日期 :
IEC 60191-6-2:2001 EN-FR 8bf766c3
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
现行
发布日期 :
2001-12-11
实施日期 :